Købe IDC08S60CEX1SA2 med BYCHPS
Køb med garanti
IDC08S60CEX1SA2
- Varenummer:
- IDC08S60CEX1SA2
- Beskrivelse:
- DIODE SIC 600V 8A SAWN WAFER
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19086 Pieces
- Datablad:
- IDC08S60CEX1SA2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IDC08S60CEX1SA2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IDC08S60CEX1SA2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1.7V @ 8A |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 600V |
| Leverandør Device Package: | Die |
| Fart: | No Recovery Time > 500mA (Io) |
| Serie: | thinQ!™ |
| Reverse Recovery Time (trr): | 0ns |
| Emballage: | Bulk |
| Pakke / tilfælde: | Die |
| Andre navne: | SP000599932 |
| Driftstemperatur - Junction: | -55°C ~ 175°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | IDC08S60CEX1SA2 |
| Udvidet beskrivelse: | Diode Silicon Carbide Schottky 600V 8A (DC) Surface Mount Die |
| Diodetype: | Silicon Carbide Schottky |
| Beskrivelse: | DIODE SIC 600V 8A SAWN WAFER |
| Nuværende - Reverse Lækage @ Vr: | 100µA @ 600V |
| Nuværende - Gennemsnitlig Rectified (Io): | 8A (DC) |
| Kapacitans @ Vr, F: | 310pF @ 1V, 1MHz |
| Email: | [email protected] |
Relaterede dele til IDC08S60CEX1SA2
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers