Købe IRFU3709 med BYCHPS
Køb med garanti
IRFU3709
- Varenummer:
- IRFU3709
- Beskrivelse:
- MOSFET N-CH 30V 90A I-PAK
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12241 Pieces
- Datablad:
- IRFU3709.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IRFU3709, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IRFU3709 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 3V @ 250µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | IPAK (TO-251) |
| Serie: | HEXFET® |
| Rds On (Max) @ Id, Vgs: | 9 mOhm @ 15A, 10V |
| Power Dissipation (Max): | 120W (Tc) |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-251-3 Short Leads, IPak, TO-251AA |
| Andre navne: | *IRFU3709 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | IRFU3709 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 2672pF @ 16V |
| Gate Charge (Qg) (Max) @ Vgs: | 41nC @ 4.5V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 30V 90A (Tc) 120W (Tc) Through Hole IPAK (TO-251) |
| Afløb til Source Voltage (VDSS): | 30V |
| Beskrivelse: | MOSFET N-CH 30V 90A I-PAK |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 90A (Tc) |
| Email: | [email protected] |
Relaterede dele til IRFU3709
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers