Købe ISL34341INZ med BYCHPS
Køb med garanti
ISL34341INZ
- Varenummer:
- ISL34341INZ
- Fabrikant:
- Intersil
- Beskrivelse:
- IC VIDEO SERDES LONG 64TQFP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19522 Pieces
- Datablad:
- ISL34341INZ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ISL34341INZ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ISL34341INZ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 1.7 V ~ 1.9 V |
|---|---|
| Leverandør Device Package: | 64-TQFP (10x10) |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 64-TQFP Exposed Pad |
| Output Type: | LVCMOS |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal udgange: | 1/24 |
| Antal indgange: | 24/1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | ISL34341INZ |
| Input Type: | LVCMOS |
| Fungere: | Serializer/Deserializer |
| Udvidet beskrivelse: | Serializer/Deserializer 24/1 Input 1/24 Output 64-TQFP (10x10) |
| Beskrivelse: | IC VIDEO SERDES LONG 64TQFP |
| Datahastighed: | - |
| Email: | [email protected] |
Relaterede dele til ISL34341INZ
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
ISL3485EFBZ-T | Intersil | IC TXRX RS422/485 8SOIC | Forespørgsel |
 |
ISL34340INZ | Intersil | IC LNG-RCH VID SERDES 64TQFP | Forespørgsel |
|
ISL34340INZ-T13 | Intersil | IC VIDEO SERDES LONG 64TQFP | Forespørgsel |
|
ISL34341INZ-T13 | Intersil | IC VIDEO SERDES LONG 64TQFP | Forespørgsel |
 |
ISL34321INZ-T13 | Intersil | IC SER/DESER LVDS SERDES 48TQFP | Forespørgsel |
|
ISL34321INZ | Intersil | IC SER/DESER LVDS SERDES 48TQFP | Forespørgsel |
|
ISL3485EFBZ | Intersil | IC TXRX RS422/485 8SOIC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers