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ISL9V5045S3S
- Varenummer:
- ISL9V5045S3S
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- IGBT 480V 51A 300W D2PAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17942 Pieces
- Datablad:
- ISL9V5045S3S.pdf
Introduktion
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specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 480V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 1.6V @ 4V, 10A |
| Testtilstand: | 300V, 1 kOhm, 5V |
| Td (tænd / sluk) @ 25 ° C: | -/10.8µs |
| Skifte energi: | - |
| Leverandør Device Package: | TO-263AB |
| Serie: | EcoSPARK® |
| Strøm - Max: | 300W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Driftstemperatur: | -40°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | ISL9V5045S3S |
| Input Type: | Logic |
| IGBT Type: | - |
| Gate Charge: | 32nC |
| Udvidet beskrivelse: | IGBT 480V 51A 300W Surface Mount TO-263AB |
| Beskrivelse: | IGBT 480V 51A 300W D2PAK |
| Nuværende - Collector Pulsed (Icm): | - |
| Nuværende - Samler (Ic) (Max): | 51A |
| Email: | [email protected] |
Relaterede dele til ISL9V5045S3S
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
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ISL9V5036P3 | Fairchild/ON Semiconductor | IGBT 390V 46A 250W TO220AB | Forespørgsel |
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ISL9V5036P3_F085 | Fairchild/ON Semiconductor | IGBT 390V 46A 250W TO220AA-3 | Forespørgsel |
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ISL9V5045S3ST_F085 | Fairchild/ON Semiconductor | IGBT 480V 51A 300W D2PAK | Forespørgsel |
 |
ISL9V5045S3ST | Fairchild/ON Semiconductor | IGBT 480V 51A 300W D2PAK | Forespørgsel |
|
ISL9V5036S3ST | Fairchild/ON Semiconductor | IGBT 390V 46A 250W TO263AB | Forespørgsel |
|
ISL9V5036S3S | Fairchild/ON Semiconductor | IGBT 390V 46A 250W TO263AB | Forespørgsel |
|
ISL9V5036S3 | Fairchild/ON Semiconductor | IGBT 390V 46A 250W TO262AA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers