Købe IXGH36N60B3D4 med BYCHPS
Køb med garanti
IXGH36N60B3D4
- Varenummer:
- IXGH36N60B3D4
- Fabrikant:
- IXYS Corporation
- Beskrivelse:
- IGBT 600V 250W TO247
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14664 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for IXGH36N60B3D4, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IXGH36N60B3D4 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 600V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 1.8V @ 15V, 30A |
| Testtilstand: | 400V, 30A, 5 Ohm, 15V |
| Td (tænd / sluk) @ 25 ° C: | 19ns/125ns |
| Skifte energi: | 540µJ (on), 800µJ (off) |
| Leverandør Device Package: | TO-247AD (IXGH) |
| Serie: | GenX3™ |
| Reverse Recovery Time (trr): | 60ns |
| Strøm - Max: | 250W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-247-3 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | IXGH36N60B3D4 |
| Input Type: | Standard |
| IGBT Type: | PT |
| Gate Charge: | 80nC |
| Udvidet beskrivelse: | IGBT PT 600V 250W Through Hole TO-247AD (IXGH) |
| Beskrivelse: | IGBT 600V 250W TO247 |
| Nuværende - Collector Pulsed (Icm): | 200A |
| Nuværende - Samler (Ic) (Max): | - |
| Email: | [email protected] |
Relaterede dele til IXGH36N60B3D4
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
IXGH36N60B3D1 | IXYS | IGBT 600V 250W TO247AD | Forespørgsel |
|
IXGH36N60A3D4 | IXYS | IGBT 600V 220W TO247 | Forespørgsel |
|
IXGH36N60B3C1 | IXYS | IGBT 600V 75A 250W TO247 | Forespørgsel |
|
IXGH30N120IH | IXYS | IGBT 1200V 50A TO-247 | Forespørgsel |
|
IXGH36N60A3 | IXYS | IGBT 600V 220W TO247 | Forespørgsel |
|
IXGH36N60B3 | IXYS | IGBT 600V 92A 250W TO247 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers