Købe LPC3141FET180,551 med BYCHPS
Køb med garanti
LPC3141FET180,551
- Varenummer:
- LPC3141FET180,551
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC MCU 32BIT ROMLESS 180TFBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16270 Pieces
- Datablad:
- LPC3141FET180,551.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for LPC3141FET180,551, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LPC3141FET180,551 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 1.1 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 180-TFBGA (12x12) |
| Fart: | 270MHz |
| Serie: | LPC3100 |
| RAM-størrelse: | 192K x 8 |
| Programhukommelsestype: | ROMless |
| Programhukommelsesstørrelse: | - |
| tilbehør: | DMA, I²S, LCD, PWM, WDT |
| Emballage: | Tray |
| Pakke / tilfælde: | 180-TFBGA |
| Andre navne: | 568-8729 935289711551 LPC3141FET180,551-ND |
| Oscillator Type: | External |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal I / O: | 20 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | LPC3141FET180,551 |
| Udvidet beskrivelse: | ARM9® LPC3100 Microcontroller IC 16/32-Bit 270MHz ROMless 180-TFBGA (12x12) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT ROMLESS 180TFBGA |
| Datakonvertere: | A/D 4x10b |
| Core Size: | 16/32-Bit |
| Core Processor: | ARM9® |
| Connectivity: | EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG |
| Email: | [email protected] |
Relaterede dele til LPC3141FET180,551
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers