Købe LT1782HS5#TRMPBF med BYCHPS
Køb med garanti
LT1782HS5#TRMPBF
- Varenummer:
- LT1782HS5#TRMPBF
- Fabrikant:
- L
- Beskrivelse:
- IC OPAMP GP 225KHZ RRO TSOT23-5
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14764 Pieces
- Datablad:
- LT1782HS5#TRMPBF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for LT1782HS5#TRMPBF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LT1782HS5#TRMPBF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Tilførsel, Single / Dual (±): | 2.5 V ~ 18 V, ±1.25 V ~ 9 V |
|---|---|
| Spænding - Indgangsforskydning: | 500µV |
| Leverandør Device Package: | TSOT-23-5 |
| Slew Rate: | 0.075 V/µs |
| Serie: | Over-The-Top® |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | SOT-23-5 Thin, TSOT-23-5 |
| Output Type: | Rail-to-Rail |
| Andre navne: | LT1782HS5#TRMPBFTR LT1782HS5TRMPBF |
| Driftstemperatur: | -40°C ~ 125°C |
| Antal kredsløb: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | LT1782HS5#TRMPBF |
| Få båndbreddeprodukt: | 225kHz |
| Udvidet beskrivelse: | General Purpose Amplifier 1 Circuit Rail-to-Rail TSOT-23-5 |
| Beskrivelse: | IC OPAMP GP 225KHZ RRO TSOT23-5 |
| Nuværende - Forsyning: | 45µA |
| Nuværende - Output / Channel: | 30mA |
| Nuværende - Input Bias: | 8nA |
| Forstærker Type: | General Purpose |
| -3db båndbredde: | - |
| Email: | [email protected] |
Relaterede dele til LT1782HS5#TRMPBF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers