Købe LT6660KCDC-2.5#TRMPBF med BYCHPS
Køb med garanti
LT6660KCDC-2.5#TRMPBF
- Varenummer:
- LT6660KCDC-2.5#TRMPBF
- Fabrikant:
- L
- Beskrivelse:
- IC VREF SERIES 2.5V 3DFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12261 Pieces
- Datablad:
- LT6660KCDC-2.5#TRMPBF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for LT6660KCDC-2.5#TRMPBF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LT6660KCDC-2.5#TRMPBF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Output (Min / Fast): | 2.5V |
|---|---|
| Spænding - Udgang (Max): | - |
| Spænding - Indgang: | 5 V ~ 30 V |
| Tolerance: | ±0.5% |
| Temperaturkoefficient: | 50ppm/°C |
| Leverandør Device Package: | 3-DFN (2x2) |
| Serie: | - |
| Reference Type: | Series |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 3-WFDFN Exposed Pad |
| Output Type: | Fixed |
| Andre navne: | LT6660KCDC-2.5#TRMPBF-ND LT6660KCDC-2.5#TRMPBFTR |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Støj - 10Hz til 10kHz: | 4ppmrms |
| Støj - 0,1 Hz til 10 Hz: | 4ppmp-p |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | LT6660KCDC-2.5#TRMPBF |
| Udvidet beskrivelse: | Series Voltage Reference IC ±0.5% 20mA 3-DFN (2x2) |
| Beskrivelse: | IC VREF SERIES 2.5V 3DFN |
| Nuværende - Forsyning: | 175µA |
| Nuværende - Output: | 20mA |
| Nuværende - Katode: | - |
| Email: | [email protected] |
Relaterede dele til LT6660KCDC-2.5#TRMPBF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers