Købe M21605G-12 med BYCHPS
Køb med garanti
M21605G-12
- Varenummer:
- M21605G-12
- Fabrikant:
- Aeroflex (MACOM Technology Solutions)
- Beskrivelse:
- 160X160 CROSSPOINT SWITCH 12.5GB
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12502 Pieces
- Datablad:
- M21605G-12.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for M21605G-12, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til M21605G-12 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Single (V +): | 1.8V |
|---|---|
| Spænding - Supply, Dual (V ±): | - |
| Skift kredsløb: | - |
| Serie: | - |
| Driftstemperatur: | - |
| On-State Resistance (Max): | - |
| Antal kanaler: | 1 |
| Multiplexer / Demultiplexer Circuit: | 160:160 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | M21605G-12 |
| Funktioner: | - |
| Udvidet beskrivelse: | Backplane Switch IC 1 Channel |
| Beskrivelse: | 160X160 CROSSPOINT SWITCH 12.5GB |
| Applikationer: | Backplane |
| -3db båndbredde: | - |
| Email: | [email protected] |
Relaterede dele til M21605G-12
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
HA4314BCPZ | Intersil | IC VIDEO CROSSPOINT SWITCH 14DIP | Forespørgsel |
 |
HD3SS3212IRKST | Texas Instruments | IC MUX 2:1 8 OHM 20VQFN | Forespørgsel |
|
TS3L110PWRE4 | Texas Instruments | IC ETHERNET SWITCH QUAD 16TSSOP | Forespørgsel |
 |
HA4314BCAZ | Intersil | IC VIDEO CROSSPOINT SWIT 16QSOP | Forespørgsel |
 |
LT1203CS8#PBF | Linear Technology | IC VIDEO MULTIPLEXER SPDT 8SOIC | Forespørgsel |
 |
PEX8609-BA50BI G | Broadcom Limited | IC PCI EXPRESS SWITCH | Forespørgsel |
 |
MAX4566CSE+ | Maxim Integrated | IC VIDEO SWITCH DUAL SPST 16SOIC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers