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M29F400FB55M32
- Varenummer:
- M29F400FB55M32
- Fabrikant:
- Micron Technology
- Beskrivelse:
- IC FLASH 4MBIT 55NS 44SO
- Blyfri Status / RoHS Status:
- Indeholder lead / RoHS-kompatibel
- Tilgængelig mængde:
- 15366 Pieces
- Datablad:
- M29F400FB55M32.pdf
Introduktion
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specifikationer
| Spænding - Forsyning: | 4.5 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 44-SO |
| Fart: | 55ns |
| Serie: | Automotive, AEC-Q100 |
| Emballage: | Bulk |
| Pakke / tilfælde: | 44-SOIC (0.496", 12.60mm Width) |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Non-Volatile |
| Hukommelsesstørrelse: | 4Mb (512K x 8, 256K x 16) |
| Hukommelsesformat: | FLASH |
| Producentens varenummer: | M29F400FB55M32 |
| grænseflade: | Parallel |
| Beskrivelse: | IC FLASH 4MBIT 55NS 44SO |
| Email: | [email protected] |
Relaterede dele til M29F400FB55M32
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
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M29F400FB5AM6F2 TR | Micron Technology Inc. | IC FLASH 4MBIT 55NS 44SO | Forespørgsel |
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M29F400FB5AM62 | Micron Technology Inc. | IC FLASH 4MBIT 55NS 44SO | Forespørgsel |
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M29F400FB55M3E2 | Micron Technology Inc. | IC FLASH 4MBIT 55NS 44SO | Forespørgsel |
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M29F400FB5AM6T2 TR | Micron Technology Inc. | IC FLASH 4MBIT 55NS 44SO | Forespørgsel |
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M29F400FB55N3E2 | Micron Technology Inc. | IC FLASH 4MBIT 55NS 48TSOP | Forespørgsel |
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M29F400FB55M3T2 TR | Micron Technology Inc. | IC FLASH 4MBIT 55NS 44SO | Forespørgsel |
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M29F400BB70M6T TR | Micron Technology Inc. | IC FLASH 4MBIT 70NS 44SO | Forespørgsel |
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M29F400FB55N3F2 TR | Micron Technology Inc. | IC FLASH 4MBIT 55NS 48TSOP | Forespørgsel |
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M29F400FB5AN6E2 | Micron Technology Inc. | IC FLASH 4MBIT 55NS 48TSOP | Forespørgsel |
|
M29F400FB55M3F2 TR | Micron Technology Inc. | IC FLASH 4MBIT 55NS 44SO | Forespørgsel |
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M29F400BB70N6E | Micron Technology Inc. | IC FLASH 4MBIT 70NS 48TSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers