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M58WR064EB70ZB6
- Varenummer:
- M58WR064EB70ZB6
- Fabrikant:
- Micron Technology
- Beskrivelse:
- IC FLASH 64MBIT 70NS 56VFBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17795 Pieces
- Datablad:
- M58WR064EB70ZB6.pdf
Introduktion
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specifikationer
| Spænding - Forsyning: | 1.65 V ~ 2.2 V |
|---|---|
| Leverandør Device Package: | 56-VFBGA (7.7x9) |
| Fart: | 70ns |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 56-VFBGA |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Non-Volatile |
| Hukommelsesstørrelse: | 64Mb (4M x 16) |
| Hukommelsesformat: | FLASH |
| Producentens varenummer: | M58WR064EB70ZB6 |
| grænseflade: | Parallel |
| Beskrivelse: | IC FLASH 64MBIT 70NS 56VFBGA |
| Email: | [email protected] |
Relaterede dele til M58WR064EB70ZB6
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
M58WR064KT7AZB6F TR | Micron Technology Inc. | IC FLASH 64MBIT 70NS 56VFBGA | Forespørgsel |
|
M58WR064KB70ZB6F TR | Micron Technology Inc. | IC FLASH 64MBIT 70NS 56VFBGA | Forespørgsel |
|
M58WR064KU70D16 | Micron Technology Inc. | IC FLASH PAR NOR SLC 64M DIE | Forespørgsel |
|
M58WR064KT70D16 | Micron Technology Inc. | IC FLASH PAR NOR SLC 64M DIE | Forespørgsel |
|
M58WR064KB7AZB6E | Micron Technology Inc. | IC FLASH 64MBIT 70NS 56VFBGA | Forespørgsel |
|
M58WR064KT7AZB6E | Micron Technology Inc. | IC FLASH 64MBIT 70NS 56VFBGA | Forespørgsel |
|
M58WR064KU70ZA6F TR | Micron Technology Inc. | IC FLASH 64MBIT 70NS 88VFBGA | Forespørgsel |
|
M58WR064KT70ZB6F TR | Micron Technology Inc. | IC FLASH 64MBIT 70NS 56VFBGA | Forespørgsel |
|
M58WR064KB70ZB6E | Micron Technology Inc. | IC FLASH 64MBIT 70NS 56VFBGA | Forespørgsel |
|
M58WR064KU70ZA6E | Micron Technology Inc. | IC FLASH 64MBIT 70NS 88VFBGA | Forespørgsel |
|
M58WR064KB7AZB6F TR | Micron Technology Inc. | IC FLASH 64MBIT 70NS 56VFBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
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- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers