Købe MAL213966229E3 med BYCHPS
Køb med garanti
MAL213966229E3
- Varenummer:
- MAL213966229E3
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP ALUM 22UF 20% 25V SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17341 Pieces
- Datablad:
- MAL213966229E3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAL213966229E3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAL213966229E3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 25V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | 0.563" L x 0.244" W (14.30mm x 6.20mm) |
| Størrelse / Dimension: | 0.563" L x 0.244" W (14.30mm x 6.20mm) |
| Serie: | 139 CLL |
| Ripple Current: | 48mA |
| Polarisering: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Nonstandard SMD |
| Andre navne: | 2222 139 66229 222213966229 BC1181TR |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | MAL213966229E3 |
| Levetid @ Temp.: | 2000 Hrs @ 105°C |
| Blyafstand: | - |
| Impedans: | 5.5 Ohm |
| Højde - Siddende (Max): | 0.272" (6.90mm) |
| Udvidet beskrivelse: | 22µF 25V Aluminum Capacitors Nonstandard SMD 10 Ohm 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 10 Ohm |
| Beskrivelse: | CAP ALUM 22UF 20% 25V SMD |
| kapacitans: | 22µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til MAL213966229E3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers