Købe MAX1227BCEE+ med BYCHPS
Køb med garanti
MAX1227BCEE+
- Varenummer:
- MAX1227BCEE+
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC ADC 12-BIT 300KSPS 16-QSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18162 Pieces
- Datablad:
- 1.MAX1227BCEE+.pdf2.MAX1227BCEE+.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAX1227BCEE+, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAX1227BCEE+ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Digital: | 2.7 V ~ 3.6 V |
|---|---|
| Spænding - Supply, Analog: | 2.7 V ~ 3.6 V |
| Leverandør Device Package: | 16-QSOP |
| Serie: | - |
| Prøveudtagningshastighed (pr. Sekund): | 300k |
| Reference Type: | External, Internal |
| Forholdet - S / H: ADC: | 1:1 |
| Emballage: | Tube |
| Pakke / tilfælde: | 16-SSOP (0.154", 3.90mm Width) |
| Driftstemperatur: | 0°C ~ 70°C |
| Antal indgange: | 4, 8 |
| Antal bitter: | 12 |
| Antal A / D-omformere: | 1 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | MAX1227BCEE+ |
| Input Type: | Differential, Single Ended |
| Funktioner: | Temperature Sensor |
| Udvidet beskrivelse: | 12 Bit Analog to Digital Converter 4, 8 Input 1 SAR 16-QSOP |
| Beskrivelse: | IC ADC 12-BIT 300KSPS 16-QSOP |
| Data Interface: | SPI |
| Konfiguration: | MUX-S/H-ADC |
| Arkitektur: | SAR |
| Email: | [email protected] |
Relaterede dele til MAX1227BCEE+
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers