Købe MAX13087ECPA+ med BYCHPS
Køb med garanti
MAX13087ECPA+
- Varenummer:
- MAX13087ECPA+
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC TXRX RS485/422 5V ESD 8-DIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14518 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAX13087ECPA+, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAX13087ECPA+ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 4.5 V ~ 5.5 V |
|---|---|
| Type: | Transceiver |
| Leverandør Device Package: | 8-PDIP |
| Serie: | - |
| Modtager Hysterese: | 100mV |
| protokol: | RS422, RS485 |
| Emballage: | Tube |
| Pakke / tilfælde: | 8-DIP (0.300", 7.62mm) |
| Driftstemperatur: | 0°C ~ 70°C |
| Antal drivere / modtagere: | 1/1 |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | MAX13087ECPA+ |
| Udvidet beskrivelse: | 1/1 Transceiver Full RS422, RS485 8-PDIP |
| Duplex: | Full |
| Beskrivelse: | IC TXRX RS485/422 5V ESD 8-DIP |
| Datahastighed: | 16Mbps |
| Email: | [email protected] |
Relaterede dele til MAX13087ECPA+
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers