Købe MAX550AEPA+ med BYCHPS
Køb med garanti
MAX550AEPA+
- Varenummer:
- MAX550AEPA+
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC DAC DUAL 8BIT 2.5-5.5V 8-DIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13667 Pieces
- Datablad:
- 1.MAX550AEPA+.pdf2.MAX550AEPA+.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAX550AEPA+, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAX550AEPA+ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Digital: | 2.5 V ~ 5.5 V |
|---|---|
| Spænding - Supply, Analog: | 2.5 V ~ 5.5 V |
| Leverandør Device Package: | 8-PDIP |
| Afregningstid: | 4µs (Typ) |
| Serie: | - |
| Reference Type: | External |
| Emballage: | Tube |
| Pakke / tilfælde: | 8-DIP (0.300", 7.62mm) |
| Output Type: | Voltage - Unbuffered |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal D / A-konvertere: | 2 |
| Antal bitter: | 8 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | MAX550AEPA+ |
| INL / DNL (LSB): | -, ±0.9 (Max) |
| Udvidet beskrivelse: | 8 Bit Digital to Analog Converter 2 8-PDIP |
| Differential Output: | No |
| Beskrivelse: | IC DAC DUAL 8BIT 2.5-5.5V 8-DIP |
| Data Interface: | SPI |
| Arkitektur: | R-2R |
| Email: | [email protected] |
Relaterede dele til MAX550AEPA+
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers