Købe MRF6V12500HR3 med BYCHPS
Køb med garanti
MRF6V12500HR3
- Varenummer:
- MRF6V12500HR3
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- FET RF 110V 1.03GHZ NI-780H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16066 Pieces
- Datablad:
- MRF6V12500HR3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MRF6V12500HR3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MRF6V12500HR3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Test: | 50V |
|---|---|
| Spændingsvurdering: | 110V |
| Transistor Type: | LDMOS |
| Leverandør Device Package: | NI-780 |
| Serie: | - |
| Power - Output: | 500W |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | NI-780 |
| Støj figur: | - |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | MRF6V12500HR3 |
| Gevinst: | 19.7dB |
| Frekvens: | 1.03GHz |
| Udvidet beskrivelse: | RF Mosfet LDMOS 50V 200mA 1.03GHz 19.7dB 500W NI-780 |
| Beskrivelse: | FET RF 110V 1.03GHZ NI-780H |
| Nuværende vurdering: | - |
| Nuværende - Test: | 200mA |
| Email: | [email protected] |
Relaterede dele til MRF6V12500HR3
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MRF6V12500HSR5 | NXP USA Inc. | FET RF 110V 1.03GHZ NI-1230H | Forespørgsel |
|
MRF6V13250HSR3 | NXP USA Inc. | FET RF 120V 1.3GHZ NI780S | Forespørgsel |
|
MRF6V12500HSR3 | NXP USA Inc. | FET RF 110V 1.03GHZ NI780HS | Forespørgsel |
 |
MRF6V12250HR3 | NXP USA Inc. | FET RF 100V 1.03GHZ NI-780 | Forespørgsel |
|
MRF6V12500HR5 | NXP USA Inc. | FET RF 110V 1.03GHZ NI-780H | Forespørgsel |
|
MRF6V12250HR5 | NXP USA Inc. | FET RF 100V 1.03GHZ NI-780 | Forespørgsel |
|
MRF6V12250HSR5 | NXP USA Inc. | FET RF 100V 1.03GHZ NI-780S | Forespørgsel |
|
MRF6V12250HSR3 | NXP USA Inc. | FET RF 100V 1.03GHZ NI-780S | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers