Købe NOJP685M004RWJ med BYCHPS
Køb med garanti
NOJP685M004RWJ
- Varenummer:
- NOJP685M004RWJ
- Fabrikant:
- AVX Corporation
- Beskrivelse:
- CAP NIOB OXIDE 6.8UF 20% 4V 0805
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15010 Pieces
- Datablad:
- NOJP685M004RWJ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NOJP685M004RWJ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NOJP685M004RWJ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 4V |
|---|---|
| Tolerance: | ±20% |
| Leverandør Device Package: | 0805 (2012 Metric) |
| Størrelse / Dimension: | 0.081" L x 0.053" W (2.05mm x 1.35mm) |
| Serie: | OxiCap® NOJ |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0805 (2012 Metric) |
| Andre navne: | 478-3202-2 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens størrelse Kode: | P |
| Producentens varenummer: | NOJP685M004RWJ |
| Højde - Siddende (Max): | 0.059" (1.50mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 6.8µF Niobium Oxide Capacitor 4V 0805 (2012 Metric) 5.3 Ohm ESR |
| ESR (Equivalent Series Resistance): | 5.3 Ohm |
| Dissipation Factor: | 6% |
| Beskrivelse: | CAP NIOB OXIDE 6.8UF 20% 4V 0805 |
| Nuværende - Lækage: | 1µA |
| kapacitans: | 6.8µF |
| Email: | [email protected] |
Relaterede dele til NOJP685M004RWJ
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
NOJC686M004RWJ | AVX Corporation | CAP NIOB OXIDE 68UF 20% 4V 2312 | Forespørgsel |
 |
NOJP685M006RWJ | AVX Corporation | CAP NIOB OXI 6.8UF 20% 6.3V 0805 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers