Købe NOSB156M008R1000V med BYCHPS
Køb med garanti
NOSB156M008R1000V
- Varenummer:
- NOSB156M008R1000V
- Fabrikant:
- AVX Corporation
- Beskrivelse:
- CAP NIOB OXID 15UF 20% 8V 1210
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15605 Pieces
- Datablad:
- NOSB156M008R1000V.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NOSB156M008R1000V, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NOSB156M008R1000V via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 8V |
|---|---|
| Tolerance: | ±20% |
| Leverandør Device Package: | 1210 (3528 Metric) |
| Størrelse / Dimension: | 0.138" L x 0.110" W (3.50mm x 2.80mm) |
| Serie: | OxiCap® NOS |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1411 (3528 Metric) |
| Andre navne: | 478-9704-2 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens størrelse Kode: | B |
| Producentens varenummer: | NOSB156M008R1000V |
| Højde - Siddende (Max): | 0.083" (2.10mm) |
| Funktioner: | Low ESR |
| Udvidet beskrivelse: | 15µF Niobium Oxide Capacitor 8V 1411 (3528 Metric) 1 Ohm ESR |
| ESR (Equivalent Series Resistance): | 1 Ohm |
| Dissipation Factor: | 10% |
| Beskrivelse: | CAP NIOB OXID 15UF 20% 8V 1210 |
| Nuværende - Lækage: | 2.4µA |
| kapacitans: | 15µF |
| Email: | [email protected] |
Relaterede dele til NOSB156M008R1000V
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
NOSB107M001R0350 | AVX Corporation | CAP NIOB OXI 100UF 20% 1.8V 1210 | Forespørgsel |
|
NOSB156M006R0600 | AVX Corporation | CAP NIOB OXID 15UF 20% 6.3V 1210 | Forespørgsel |
|
NOSB106M008R1000V | AVX Corporation | CAP NIOB OXID 10UF 20% 8V 1210 | Forespørgsel |
 |
NOJD157M004RWJ | AVX Corporation | CAP NIOB OXIDE 150UF 20% 4V 2917 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers