Købe NS7520B-1-C36 med BYCHPS
Køb med garanti
NS7520B-1-C36
- Varenummer:
- NS7520B-1-C36
- Fabrikant:
- Digi International
- Beskrivelse:
- IC ARM MICROPROCESSOR 177BGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19893 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for NS7520B-1-C36, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NS7520B-1-C36 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 1.4 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 177-BGA (13x13) |
| Serie: | NET+ARM® |
| RAM-størrelse: | External |
| Programhukommelsestype: | External Program Memory |
| Emballage: | Tray |
| Pakke / tilfælde: | 177-LFBGA |
| Andre navne: | 602-1417 NS7520B-1-C36-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal I / O: | 16 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | NS7520B-1-C36 |
| grænseflade: | EBI/EMI, Ethernet, DMA, SPI, UART |
| Beskrivelse: | IC ARM MICROPROCESSOR 177BGA |
| Core Processor: | ARM7® |
| Controller Series: | - |
| Applikationer: | Network Processor |
| Email: | [email protected] |
Relaterede dele til NS7520B-1-C36
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
NS7520B-1-I46 | Digi International | IC ARM MICROPROCESSOR 177BGA | Forespørgsel |
 |
MSP430BT5190IZQWR | Texas Instruments | IC MCU 16BIT 256KB FLASH 113BGA | Forespørgsel |
|
NS7520B-1-I55 | Digi International | IC ARM MICROPROCESSOR 177BGA | Forespørgsel |
 |
CYUSB3314-88LTXI | Cypress Semiconductor Corp | IC USB 3.0 HUB 4-PORT 88QFN | Forespørgsel |
|
NS7520B-1-C55 | Digi International | IC ARM MICROPROCESSOR 177BGA | Forespørgsel |
|
CP3UB26G18NEPX | Texas Instruments | IC CPU RISC USB CAN 128-LQFP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers