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OMAP5910JGZG2
- Varenummer:
- OMAP5910JGZG2
- Fabrikant:
- Beskrivelse:
- IC MPU OMAP-59XX 150MHZ 289BGA
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 18951 Pieces
- Datablad:
- OMAP5910JGZG2.pdf
Introduktion
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specifikationer
| Spænding - I / O: | 1.8V, 2.75V, 3.3V |
|---|---|
| USB: | USB 2.0 (2) |
| Leverandør Device Package: | 289-BGA (12x12) |
| Fart: | 150MHz |
| Serie: | OMAP-59xx |
| Sikkerhedsfunktioner: | - |
| SATA: | - |
| RAM-controllere: | SDRAM |
| Emballage: | Tray |
| Pakke / tilfælde: | 289-TFBGA |
| Andre navne: | 296-16744 |
| Driftstemperatur: | -40°C ~ 85°C (TC) |
| Antal kerne / busbredde: | 1 Core, 32-Bit |
| Fugtfølsomhedsniveau (MSL): | 4 (72 Hours) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | OMAP5910JGZG2 |
| Grafik acceleration: | No |
| Udvidet beskrivelse: | ARM9TDMI Microprocessor IC OMAP-59xx 1 Core, 32-Bit 150MHz 289-BGA (12x12) |
| Ethernet: | - |
| Display & Interface Controllers: | Keypad, LCD |
| Beskrivelse: | IC MPU OMAP-59XX 150MHZ 289BGA |
| Core Processor: | ARM9TDMI |
| Co-processorer / DSP: | Signal Processing; C55x, System Control; CP15 |
| Yderligere grænseflader: | 1-Wire/HDQ, AC97, I²C, I²S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART |
| Email: | [email protected] |
Relaterede dele til OMAP5910JGZG2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
|
OMAP5910JGDY2 | Texas Instruments | IC MPU OMAP-59XX 150MHZ 289BGA | Forespørgsel |
|
OMAP5912ZDY | Texas Instruments | IC MPU OMAP-59XX 192MHZ 289BGA | Forespørgsel |
|
OMAP5910JZDY2 | Texas Instruments | IC MPU OMAP-59XX 150MHZ 289BGA | Forespørgsel |
|
OMAP5910JZZG2 | Texas Instruments | IC MPU OMAP-59XX 150MHZ 289BGA | Forespørgsel |
|
OMAP5912ZZG | Texas Instruments | IC MPU OMAP-59XX 192MHZ 289BGA | Forespørgsel |
|
OMAP5910JGDY1R | Texas Instruments | IC MPU OMAP-59XX 150MHZ 289BGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers