Købe P2CF-11-E med BYCHPS
Køb med garanti
P2CF-11-E
- Varenummer:
- P2CF-11-E
- Fabrikant:
- Omron Automation & Safety
- Beskrivelse:
- SOCKET 11-PIN FOR H7CN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17261 Pieces
- Datablad:
- P2CF-11-E.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for P2CF-11-E, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til P2CF-11-E via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Socket |
|---|---|
| Afslutningsstil: | Screw Terminal |
| Serie: | - |
| Andre navne: | P2CF-11-E-ND P2CF11E Z3224 |
| Antal positioner: | 11 |
| Monteringstype: | DIN Rail |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 2 Weeks |
| Producentens varenummer: | P2CF-11-E |
| Til brug med / relaterede produkter: | Multiple Series |
| Funktioner: | - |
| Udvidet beskrivelse: | Relay Socket DIN Rail |
| Beskrivelse: | SOCKET 11-PIN FOR H7CN |
| Email: | [email protected] |
Relaterede dele til P2CF-11-E
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
P2CF-08 | Omron Automation and Safety | SOCKET DIN MNT 8PIN SCREW TERM | Forespørgsel |
 |
P2CF-11 | Omron Automation and Safety | SOCKET DIN MNT 11PIN SCREW TERM | Forespørgsel |
 |
P2CF-08-E | Omron Automation and Safety | SOCKET 8-PIN FOR H3CR-H | Forespørgsel |
 |
RSL116067 | Amphenol PCD | EXTENDED HEIGHT, 2 POLE/10 AMP, | Forespørgsel |
 |
S-PS | Panasonic Electric Works | ACCY RELAY SOCKET FOR S SERIES | Forespørgsel |
 |
HC4-HSF-K | Panasonic Electric Works | SOCKET SCRW FRONT WIRE HC4 RELAY | Forespørgsel |
 |
PF113A | Omron Automation and Safety | SOCKET RELAY 11PIN 5A | Forespørgsel |
|
RSE116667-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørgsel |
 |
2271015 | Phoenix Contact | PLUG-IN BASE STD I/O MODULES | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers