Købe PAM2307BECADJR med BYCHPS
Køb med garanti
PAM2307BECADJR
- Varenummer:
- PAM2307BECADJR
- Fabrikant:
- Diodes Incorporated
- Beskrivelse:
- IC REG BUCK ADJ 3A SYNC 8SOIC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17621 Pieces
- Datablad:
- PAM2307BECADJR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PAM2307BECADJR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PAM2307BECADJR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Output (Min / Fast): | 0.6V |
|---|---|
| Spænding - Udgang (Max): | 5.5V |
| Spænding - Indgang (Min): | 2.7V |
| Spænding - Indgang (Max): | 5.5V |
| Topologi: | Buck |
| Synkron-ensretter: | Yes |
| Leverandør Device Package: | 8-SOP-EP |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| Output Type: | Adjustable |
| Output Configuration: | Positive |
| Andre navne: | PAM2307BECADJRDI |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal udgange: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | PAM2307BECADJR |
| Fungere: | Step-Down |
| Frequency - Switching: | 1.5MHz |
| Udvidet beskrivelse: | Buck Switching Regulator IC Positive Adjustable 0.6V 1 Output 3A 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| Beskrivelse: | IC REG BUCK ADJ 3A SYNC 8SOIC |
| Nuværende - Output: | 3A |
| Email: | [email protected] |
Relaterede dele til PAM2307BECADJR
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers