Købe PBSS5260QAZ med BYCHPS
Køb med garanti
PBSS5260QAZ
- Varenummer:
- PBSS5260QAZ
- Fabrikant:
- Nexperia
- Beskrivelse:
- TRANS PNP 60V 1.7A DFN1010D-3
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16683 Pieces
- Datablad:
- PBSS5260QAZ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PBSS5260QAZ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PBSS5260QAZ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 60V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | 400mV @ 50mA, 1A |
| Transistor Type: | PNP |
| Leverandør Device Package: | DFN1010D-3 |
| Serie: | - |
| Strøm - Max: | 325mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 3-XDFN Exposed Pad |
| Andre navne: | 1727-1468-2 1727-1468-2-ND 1727-2386-2 568-10939-2 568-10939-2-ND 568-12685-2 568-12685-2-ND 934067164147 PBSS5260QA PBSS5260QAZ-ND |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | PBSS5260QAZ |
| Frekvens - Overgang: | 150MHz |
| Udvidet beskrivelse: | Bipolar (BJT) Transistor PNP 60V 1.7A 150MHz 325mW Surface Mount DFN1010D-3 |
| Beskrivelse: | TRANS PNP 60V 1.7A DFN1010D-3 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 30 @ 1.7A, 2V |
| Nuværende - Collector Cutoff (Max): | 100nA (ICBO) |
| Nuværende - Samler (Ic) (Max): | 1.7A |
| Email: | [email protected] |
Relaterede dele til PBSS5260QAZ
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers