Købe PH2729-130M med BYCHPS
Køb med garanti
PH2729-130M
- Varenummer:
- PH2729-130M
- Fabrikant:
- Aeroflex (MACOM Technology Solutions)
- Beskrivelse:
- TRANSISTOR 130WPK 2.7-2.9GHZ
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12698 Pieces
- Datablad:
- PH2729-130M.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PH2729-130M, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PH2729-130M via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 63V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | - |
| Serie: | - |
| Strøm - Max: | 130W |
| Emballage: | Bulk |
| Pakke / tilfælde: | - |
| Andre navne: | 1465-1197 |
| Driftstemperatur: | 200°C (TJ) |
| Støjbillede (dB Typ @ f): | - |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 44 Weeks |
| Producentens varenummer: | PH2729-130M |
| Gevinst: | 9.73dB ~ 8.85dB |
| Frekvens - Overgang: | - |
| Udvidet beskrivelse: | RF Transistor NPN 63V 12.5A 130W Chassis Mount |
| Beskrivelse: | TRANSISTOR 130WPK 2.7-2.9GHZ |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | - |
| Nuværende - Samler (Ic) (Max): | 12.5A |
| Email: | [email protected] |
Relaterede dele til PH2729-130M
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PH2729-25M | M/A-Com Technology Solutions | TRANS BIPOLAR 25W 2.7-2.9GHZ | Forespørgsel |
 |
NE461M02-AZ | CEL | RF TRANSISTOR NPN SOT-89 | Forespørgsel |
 |
MMBTH24-7 | Diodes Incorporated | TRANS NPN VHF/UHF 40V SOT23-3 | Forespørgsel |
 |
MCH3007-TL-H | ON Semiconductor | IC AMP LN 12V 30MA MCPH3 | Forespørgsel |
 |
BFR 182 E6327 | Infineon Technologies | TRANSISTOR NPN RF 12V SOT-23 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers