Købe PTN3460IBS/F1MP med BYCHPS
Køb med garanti
PTN3460IBS/F1MP
- Varenummer:
- PTN3460IBS/F1MP
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC BRIDGE DISP PORT-LVDS 56HVQFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16681 Pieces
- Datablad:
- PTN3460IBS/F1MP.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PTN3460IBS/F1MP, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PTN3460IBS/F1MP via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3.3V |
|---|---|
| Leverandør Device Package: | 56-HVQFN (7x7) |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 56-VFQFN Exposed Pad |
| Andre navne: | 568-11583-2 935304912528 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 7 Weeks |
| Producentens varenummer: | PTN3460IBS/F1MP |
| grænseflade: | - |
| Udvidet beskrivelse: | LVDS Interface 56-HVQFN (7x7) |
| Beskrivelse: | IC BRIDGE DISP PORT-LVDS 56HVQFN |
| Applikationer: | LVDS |
| Email: | [email protected] |
Relaterede dele til PTN3460IBS/F1MP
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PTN3460BS/F4Y | NXP USA Inc. | IC BRIDGE DISP PORT-LVDS 56HVQFN | Forespørgsel |
|
PTN3460BS/F2,518 | NXP USA Inc. | IC SPECIALIZED | Forespørgsel |
 |
PTN3460IBS/F2MP | NXP USA Inc. | IC DISPLAYPORT TO LVDS 56HVQFN | Forespørgsel |
|
PTN3460IBS/F1Z | NXP USA Inc. | IC BRIDGE DISP PORT-LVDS 56HVQFN | Forespørgsel |
|
PTN3460BS/F3Y | NXP USA Inc. | IC ADAPTER DISPLAY-LVDS 56HVQFN | Forespørgsel |
|
PTN3460IBS/F2Z | NXP USA Inc. | IC DISPLAYPORT TO LVDS 56HVQFN | Forespørgsel |
|
PTN3460BS/F6Y | NXP USA Inc. | IC DISPLAYPORT TO LVDS 56HVQFN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers