Købe R4F2472VBR34DV med BYCHPS
Køb med garanti
R4F2472VBR34DV
- Varenummer:
- R4F2472VBR34DV
- Fabrikant:
- Renesas Electronics America
- Beskrivelse:
- IC MCU 16BIT 512KB FLASH 176BGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16201 Pieces
- Datablad:
- R4F2472VBR34DV.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for R4F2472VBR34DV, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til R4F2472VBR34DV via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 3 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 176-LFBGA (13x13) |
| Fart: | 34MHz |
| Serie: | H8® H8S/2400 |
| RAM-størrelse: | 40K x 8 |
| Programhukommelsestype: | FLASH |
| Programhukommelsesstørrelse: | 512KB (512K x 8) |
| tilbehør: | DMA, POR, PWM, WDT |
| Emballage: | Tray |
| Pakke / tilfælde: | 176-LFBGA |
| Oscillator Type: | External |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal I / O: | 110 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 24 Weeks |
| Producentens varenummer: | R4F2472VBR34DV |
| Udvidet beskrivelse: | H8S/2600 H8® H8S/2400 Microcontroller IC 16-Bit 34MHz 512KB (512K x 8) FLASH 176-LFBGA (13x13) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 16BIT 512KB FLASH 176BGA |
| Datakonvertere: | A/D 8x10b |
| Core Size: | 16-Bit |
| Core Processor: | H8S/2600 |
| Connectivity: | Ethernet, I²C, LPC, PECI, SCI, SSU, USB |
| Email: | [email protected] |
Relaterede dele til R4F2472VBR34DV
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers