Købe RPER71H335K3M1C60A med BYCHPS
Køb med garanti
RPER71H335K3M1C60A
- Varenummer:
- RPER71H335K3M1C60A
- Fabrikant:
- Murata Electronics
- Beskrivelse:
- CAP CER 3.3UF 50V X7R RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13470 Pieces
- Datablad:
- RPER71H335K3M1C60A.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for RPER71H335K3M1C60A, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til RPER71H335K3M1C60A via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 50V |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | - |
| Temperaturkoefficient: | X7R |
| Størrelse / Dimension: | 0.217" L x 0.157" W (5.50mm x 4.00mm) |
| Serie: | RPE |
| Vurderinger: | - |
| Emballage: | Tape & Box (TB) |
| Pakke / tilfælde: | Radial |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | RPER71H335K3M1C60A |
| Lead Style: | Formed Leads - Kinked |
| Blyafstand: | 0.197" (5.00mm) |
| Højde - Siddende (Max): | 0.248" (6.30mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 3.3µF ±10% 50V Ceramic Capacitor X7R Radial |
| Beskrivelse: | CAP CER 3.3UF 50V X7R RADIAL |
| kapacitans: | 3.3µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til RPER71H335K3M1C60A
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers