Købe SPM3012T-3R3M-CA med BYCHPS
Køb med garanti
SPM3012T-3R3M-CA
- Varenummer:
- SPM3012T-3R3M-CA
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- FIXED IND 3.3UH 1.5A 210 MOHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16886 Pieces
- Datablad:
- SPM3012T-3R3M-CA.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SPM3012T-3R3M-CA, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SPM3012T-3R3M-CA via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Leverandør Device Package: | - |
| Størrelse / Dimension: | 0.126" L x 0.118" W (3.20mm x 3.00mm) |
| Afskærmning: | Unshielded |
| Serie: | SPM-CA |
| Vurderinger: | - |
| Q @ Freq: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Nonstandard |
| Andre navne: | 445-172935-2 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Powdered Iron |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | SPM3012T-3R3M-CA |
| selvinduktion: | 3.3µH |
| Højde - Siddende (Max): | 0.047" (1.20mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | - |
| Udvidet beskrivelse: | 3.3µH Unshielded Wirewound Inductor 1.5A 210 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 3.3UH 1.5A 210 MOHM |
| DC-resistens (DCR): | 210 mOhm Max |
| Nuværende vurdering: | 1.5A |
| Nuværende - Mætning: | 1.8A |
| Email: | [email protected] |
Relaterede dele til SPM3012T-3R3M-CA
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers