Købe SSC7102-GQ-AA0-TR med BYCHPS
Køb med garanti
SSC7102-GQ-AA0-TR
- Varenummer:
- SSC7102-GQ-AA0-TR
- Fabrikant:
- Micrel / Microchip Technology
- Beskrivelse:
- IC SENSOR FUSION HUB 84TFBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14995 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for SSC7102-GQ-AA0-TR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SSC7102-GQ-AA0-TR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Hub |
|---|---|
| Leverandør Device Package: | 84-TFBGA (6x6) |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 84-TFBGA |
| Output Type: | - |
| Driftstemperatur: | - |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | SSC7102-GQ-AA0-TR |
| grænseflade: | I²C |
| Input Type: | - |
| Beskrivelse: | IC SENSOR FUSION HUB 84TFBGA |
| Nuværende - Forsyning: | - |
| Email: | [email protected] |
Relaterede dele til SSC7102-GQ-AA0-TR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SSC7102-GQ-AA0 | Microchip Technology | IC SENSOR FUSION HUB 84TFBGA | Forespørgsel |
|
SSC7102-GQ-BA0 | Microchip Technology | IC SENSOR FUSION MOVEA 84TFBGA | Forespørgsel |
|
SSC7102-GQ-BA0-TR | Microchip Technology | IC SENSOR FUSION MOVEA 84TFBGA | Forespørgsel |
|
SSC7102-GQ-AB2-TR | Microchip Technology | IC SENSOR HUB LPC 84TFBGA | Forespørgsel |
|
SSC7102-GQ-AB2 | Microchip Technology | SENSOR FUSION HUB | Forespørgsel |
 |
MCP9600-E/MX | Microchip Technology | IC THERMOCOUPLE TO I2C 20MQFN | Forespørgsel |
 |
SSC7150-ML-AB0 | Microchip Technology | IC SENSOR FUSION HUB 28QFN | Forespørgsel |
 |
XTR116UA/2K5 | Texas Instruments | IC 4 TO 20MA TRANSMITTER 8-SOIC | Forespørgsel |
 |
MAX35101EHJ+ | Maxim Integrated | IC TIME-TO-DGTL CONV W/AFE TQFP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers