Købe SSM2302CPZ-REEL7 med BYCHPS
Køb med garanti
SSM2302CPZ-REEL7
- Varenummer:
- SSM2302CPZ-REEL7
- Fabrikant:
- AD
- Beskrivelse:
- IC AMP AUDIO 1.4W STER D 16LFCSP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12080 Pieces
- Datablad:
- SSM2302CPZ-REEL7.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SSM2302CPZ-REEL7, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SSM2302CPZ-REEL7 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2.5 V ~ 5 V |
|---|---|
| Type: | Class D |
| Leverandør Device Package: | 16-LFCSP-VQ (3x3) |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 16-VFQFN Exposed Pad, CSP |
| Output Type: | 2-Channel (Stereo) |
| Andre navne: | SSM2302CPZ-REEL7TR SSM2302CPZREEL7 |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Max Output Power x Kanaler @ Load: | 1.4W x 2 @ 8 Ohm |
| Producentens varenummer: | SSM2302CPZ-REEL7 |
| Funktioner: | Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown |
| Udvidet beskrivelse: | Amplifier IC 2-Channel (Stereo) Class D 16-LFCSP-VQ (3x3) |
| Beskrivelse: | IC AMP AUDIO 1.4W STER D 16LFCSP |
| Email: | [email protected] |
Relaterede dele til SSM2302CPZ-REEL7
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers