Købe SSM3K315T(TE85L,F) med BYCHPS
Køb med garanti
SSM3K315T(TE85L,F)
- Varenummer:
- SSM3K315T(TE85L,F)
- Fabrikant:
- Toshiba Semiconductor
- Beskrivelse:
- MOSFET N-CH 30V 6A TSM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12869 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for SSM3K315T(TE85L,F), vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SSM3K315T(TE85L,F) via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 2.5V @ 1mA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | TSM |
| Serie: | U-MOSIV |
| Rds On (Max) @ Id, Vgs: | 27.6 mOhm @ 4A, 10V |
| Power Dissipation (Max): | 700mW (Ta) |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | SSM3K315T(T5LFT)TR SSM3K315T(T5LFT)TR-ND SSM3K315T(TE85L) SSM3K315T(TE85L)TR SSM3K315T(TE85L)TR-ND SSM3K315T(TE85LF)TR SSM3K315TTE85L |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | SSM3K315T(TE85L,F) |
| Inputkapacitans (Ciss) (Max) @ Vds: | 450pF @ 15V |
| Gate Charge (Qg) (Max) @ Vgs: | 10.1nC @ 10V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 30V 6A (Ta) 700mW (Ta) Surface Mount TSM |
| Afløb til Source Voltage (VDSS): | 30V |
| Beskrivelse: | MOSFET N-CH 30V 6A TSM |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 6A (Ta) |
| Email: | [email protected] |
Relaterede dele til SSM3K315T(TE85L,F)
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers