Købe SST175-T1-E3 med BYCHPS
Køb med garanti
SST175-T1-E3
- Varenummer:
- SST175-T1-E3
- Fabrikant:
- Dale / Vishay
- Beskrivelse:
- MOSFET P-CH JFET 30V SOT23-3
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15419 Pieces
- Datablad:
- SST175-T1-E3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SST175-T1-E3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SST175-T1-E3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Cutoff (VGS off) @ Id: | - |
|---|---|
| Leverandør Device Package: | TO-236 (SOT-23) |
| Serie: | - |
| Modstand - RDS (Til): | - |
| Strøm - Max: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | Q7165861FX SST175T1E3 |
| Driftstemperatur: | - |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | SST175-T1-E3 |
| Inputkapacitans (Ciss) (Max) @ Vds: | - |
| FET Type: | - |
| Udvidet beskrivelse: | JFET Surface Mount TO-236 (SOT-23) |
| Afløb til Source Voltage (VDSS): | - |
| Beskrivelse: | MOSFET P-CH JFET 30V SOT23-3 |
| Nuværende - Afløb (Idss) @ Vds (Vgs = 0): | - |
| Email: | [email protected] |
Relaterede dele til SST175-T1-E3
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
J270 | Fairchild/ON Semiconductor | JFET P-CH 30V 0.35W TO92 | Forespørgsel |
 |
BFR31,215 | NXP USA Inc. | JFET N-CH 10MA 250MW SOT23 | Forespørgsel |
 |
CMPF4391 TR | Central Semiconductor Corp | JFET N-CH 40V 50MA SOT23 | Forespørgsel |
 |
SST5484-E3 | Vishay Siliconix | JFET P-CH 35V 1MA SOT-23 | Forespørgsel |
 |
2SK33720TL | Panasonic Electronic Components | JFET N-CH 2MA 100MW SSSMINI-3P | Forespørgsel |
 |
2N5115UB | Microsemi Corporation | P CHANNEL JFET | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers