Købe ST33001B med BYCHPS
Køb med garanti
ST33001B
- Varenummer:
- ST33001B
- Fabrikant:
- U.S. Sensor
- Beskrivelse:
- ICL 33 OHM 20% 1A 13.97MM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13283 Pieces
- Datablad:
- ST33001B.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ST33001B, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ST33001B via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±20% |
|---|---|
| Serie: | ST |
| R @ Current: | 1.075 Ohm |
| R 25 ° C: | 33 Ohm |
| Emballage: | Bulk |
| Producentens varenummer: | ST33001B |
| Blyafstand: | 0.200" (5.08mm) |
| Udvidet beskrivelse: | Inrush Current Limiter 33 Ohm Ohm ±20% 0.550" (13.97mm) |
| Diameter: | 0.550" (13.97mm) |
| Beskrivelse: | ICL 33 OHM 20% 1A 13.97MM |
| Strøm - Stabil tilstand Maks: | 1A |
| Godkendelser: | - |
| Email: | [email protected] |
Relaterede dele til ST33001B
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
ST33001D | US Sensor | ICL 33 OHM 20% 500MA 11.43MM | Forespørgsel |
 |
B57153S160M | EPCOS (TDK) | ICL 16 OHM 20% 1.7A 8.5MM | Forespørgsel |
 |
SG27 | Ametherm | ICL 10 OHM 0.15% 6A 12.7MM | Forespørgsel |
 |
CL-50B | Amphenol Advanced Sensors | ICL 7 OHM 5A 19.56MM | Forespørgsel |
 |
CL-70A | Amphenol Advanced Sensors | ICL 16 OHM 25% 4A 19.56MM | Forespørgsel |
|
ST33001C | US Sensor | ICL 33 OHM 20% 1.5A 15.24MM | Forespørgsel |
 |
NF15AA0100M-- | AVX Corporation | ICL 10 OHM 20% 3.7A 15MM | Forespørgsel |
|
NF10AA0121M-- | AVX Corporation | ICL 120 OHM 20% 1.2A 9.9MM | Forespørgsel |
 |
PTCEL13R121MBE | Vishay BC Components | ICL 120 OHM 40A 13MM | Forespørgsel |
 |
B57236S0809L002 | EPCOS (TDK) | ICL 8 OHM 15% 3.7A 11.51MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers