Købe STGB18N40LZ-1 med BYCHPS
Køb med garanti
STGB18N40LZ-1
- Varenummer:
- STGB18N40LZ-1
- Fabrikant:
- ST
- Beskrivelse:
- IGBT 420V 30A 150W I2PAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13544 Pieces
- Datablad:
- STGB18N40LZ-1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for STGB18N40LZ-1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til STGB18N40LZ-1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 420V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 1.7V @ 4.5V, 10A |
| Testtilstand: | 300V, 10A, 5V |
| Td (tænd / sluk) @ 25 ° C: | 650ns/13.5µs |
| Skifte energi: | - |
| Leverandør Device Package: | I2PAK |
| Serie: | PowerMESH™ |
| Strøm - Max: | 150W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-262-3 Long Leads, I²Pak, TO-262AA |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | STGB18N40LZ-1 |
| Input Type: | Logic |
| IGBT Type: | - |
| Gate Charge: | 29nC |
| Udvidet beskrivelse: | IGBT 420V 30A 150W Through Hole I2PAK |
| Beskrivelse: | IGBT 420V 30A 150W I2PAK |
| Nuværende - Collector Pulsed (Icm): | 40A |
| Nuværende - Samler (Ic) (Max): | 30A |
| Email: | [email protected] |
Relaterede dele til STGB18N40LZ-1
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers