Købe STGY80H65DFB med BYCHPS
Køb med garanti
STGY80H65DFB
- Varenummer:
- STGY80H65DFB
- Fabrikant:
- ST
- Beskrivelse:
- IGBT 650V 120A 469W MAX247
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16723 Pieces
- Datablad:
- STGY80H65DFB.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for STGY80H65DFB, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til STGY80H65DFB via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 650V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 2V @ 15V, 80A |
| Testtilstand: | 400V, 80A, 10 Ohm, 15V |
| Td (tænd / sluk) @ 25 ° C: | 84ns/280ns |
| Skifte energi: | 2.1mJ (on), 1.5mJ (off) |
| Leverandør Device Package: | MAX247™ |
| Serie: | - |
| Reverse Recovery Time (trr): | 85ns |
| Strøm - Max: | 469W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-247-3 |
| Andre navne: | 497-14564-5 STGY80H65DFB-ND |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 20 Weeks |
| Producentens varenummer: | STGY80H65DFB |
| Input Type: | Standard |
| IGBT Type: | Trench Field Stop |
| Gate Charge: | 414nC |
| Udvidet beskrivelse: | IGBT Trench Field Stop 650V 120A 469W Through Hole MAX247™ |
| Beskrivelse: | IGBT 650V 120A 469W MAX247 |
| Nuværende - Collector Pulsed (Icm): | 240A |
| Nuværende - Samler (Ic) (Max): | 120A |
| Email: | [email protected] |
Relaterede dele til STGY80H65DFB
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers