Købe T92S11A12-120 med BYCHPS
Køb med garanti
T92S11A12-120
- Varenummer:
- T92S11A12-120
- Beskrivelse:
- RELAY GEN PURPOSE DPDT 30A 120V
- Blyfri Status / RoHS Status:
- Indeholder lead / RoHS-kompatibel
- Tilgængelig mængde:
- 14374 Pieces
- Datablad:
- T92S11A12-120.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for T92S11A12-120, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til T92S11A12-120 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 96 VAC |
|---|---|
| Sluk spænding (Min): | 12 VAC |
| Afslutningsstil: | PC Pin |
| Skiftespænding: | 277VAC, 28VDC - Max |
| Serie: | T92 |
| Udgivelsestid: | 15ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 8-1393211-0 8-1393211-0-ND 813932110 PB1412 T92S11A12-120-ND |
| Driftstemperatur: | -55°C ~ 65°C |
| Brug tid: | 15ms |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 23 Weeks |
| Producentens varenummer: | T92S11A12-120 |
| Funktioner: | Insulation - Class F, Sealed - Fully |
| Udvidet beskrivelse: | General Purpose Relay DPDT (2 Form C) 120VAC Coil Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE DPDT 30A 120V |
| Kontakt Rating (Aktuel): | 30A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontaktformular: | DPDT (2 Form C) |
| Spole spænding: | 120VAC |
| Spole type: | Non Latching |
| Coil Resistance: | 950 Ohms |
| Coil Power: | 4 VA |
| Coil Current: | 33.3mA |
| Email: | [email protected] |
Relaterede dele til T92S11A12-120
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers