Købe T9AP1D52-48-01 med BYCHPS
Køb med garanti
T9AP1D52-48-01
- Varenummer:
- T9AP1D52-48-01
- Beskrivelse:
- RELAY GEN PURPOSE SPST 30A 48V
- Blyfri Status / RoHS Status:
- Indeholder lead / RoHS-kompatibel
- Tilgængelig mængde:
- 13585 Pieces
- Datablad:
- T9AP1D52-48-01.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for T9AP1D52-48-01, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til T9AP1D52-48-01 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 36 VDC |
|---|---|
| Sluk spænding (Min): | 4.8 VDC |
| Afslutningsstil: | Quick Connect - 0.187"/0.250" |
| Skiftespænding: | 277VAC - Max |
| Serie: | T9A |
| Udgivelsestid: | 15ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 5-1419102-7 5-1419102-7-ND 514191027 PB1413 T9AP1D52-48-01-ND |
| Driftstemperatur: | -55°C ~ 85°C |
| Brug tid: | 15ms |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 17 Weeks |
| Producentens varenummer: | T9AP1D52-48-01 |
| Funktioner: | Insulation - Class F |
| Udvidet beskrivelse: | General Purpose Relay SPST-NO (1 Form A) 48VDC Coil Chassis Mount |
| Beskrivelse: | RELAY GEN PURPOSE SPST 30A 48V |
| Kontakt Rating (Aktuel): | 30A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontaktformular: | SPST-NO (1 Form A) |
| Spole spænding: | 48VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 2.3 kOhms |
| Coil Power: | 1 W |
| Coil Current: | 21mA |
| Email: | [email protected] |
Relaterede dele til T9AP1D52-48-01
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers