Købe TK17N65W,S1F med BYCHPS
Køb med garanti
TK17N65W,S1F
- Varenummer:
- TK17N65W,S1F
- Fabrikant:
- Toshiba Semiconductor
- Beskrivelse:
- MOSFET N-CH 650V 17.3A T0247
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18536 Pieces
- Datablad:
- TK17N65W,S1F.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TK17N65W,S1F, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TK17N65W,S1F via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 3.5V @ 900µA |
|---|---|
| Vgs (Max): | ±30V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | TO-247 |
| Serie: | DTMOSIV |
| Rds On (Max) @ Id, Vgs: | 200 mOhm @ 8.7A, 10V |
| Power Dissipation (Max): | 165W (Tc) |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-247-3 |
| Andre navne: | TK17N65W,S1F(S TK17N65WS1F |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | TK17N65W,S1F |
| Inputkapacitans (Ciss) (Max) @ Vds: | 1800pF @ 300V |
| Gate Charge (Qg) (Max) @ Vgs: | 45nC @ 10V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 650V 17.3A (Ta) 165W (Tc) Through Hole TO-247 |
| Drevspænding (Maks. Rds On, Min Rds On): | 10V |
| Afløb til Source Voltage (VDSS): | 650V |
| Beskrivelse: | MOSFET N-CH 650V 17.3A T0247 |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 17.3A (Ta) |
| Email: | [email protected] |
Relaterede dele til TK17N65W,S1F
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers