Købe XQ17V16-DIE0628 med BYCHPS
Køb med garanti
XQ17V16-DIE0628
- Varenummer:
- XQ17V16-DIE0628
- Fabrikant:
- Xilinx
- Beskrivelse:
- IC PROM SERIAL 16MB DIE
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12117 Pieces
- Datablad:
- XQ17V16-DIE0628.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for XQ17V16-DIE0628, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til XQ17V16-DIE0628 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | Die |
| Serie: | - |
| Programmerbar Type: | OTP |
| Emballage: | Tray |
| Pakke / tilfælde: | Die |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Hukommelsesstørrelse: | 16Mb |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | XQ17V16-DIE0628 |
| Beskrivelse: | IC PROM SERIAL 16MB DIE |
| Email: | [email protected] |
Relaterede dele til XQ17V16-DIE0628
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
XQ17V16VQ44N | Xilinx Inc. | IC PROM SERIAL 16MB 44-VQFN | Forespørgsel |
|
XQ17V16CK44M | Xilinx Inc. | IC MEM PROM 16MB 3.3V 44CCC | Forespørgsel |
 |
EPC1064PC8 | Altera | IC CONFIG DEVICE 65KBIT 8DIP | Forespørgsel |
 |
AT17LV128-10SC | Microchip Technology | IC SRL CONFIG EEPROM 128K 20SOIC | Forespørgsel |
|
XQ17V16CC44M | Xilinx Inc. | PROM 16M-BIT 3.3V 44CCC | Forespørgsel |
|
XC17S10VOG8C | Xilinx Inc. | IC PROM SERIAL 10K 8-SOIC | Forespørgsel |
 |
XC1701LPCG20I | Xilinx Inc. | IC PROM SERIAL 1K 20-PLCC | Forespørgsel |
|
AT17F080-30BJI | Microchip Technology | IC FLASH CONFIG 8M 44PLCC | Forespørgsel |
 |
AT17LV256A-10JC | Microchip Technology | IC SRL CONFG EEPROM 256K 20-PLCC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers