Købe 170L9653 med BYCHPS
Køb med garanti
170L9653
- Varenummer:
- 170L9653
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- FUSE 1000A 660V 3KW/110 AR
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14499 Pieces
- Datablad:
- 170L9653.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 170L9653, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 170L9653 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Størrelse / Dimension: | - |
|---|---|
| Serie: | * |
| Emballage: | - |
| Pakke / tilfælde: | - |
| Monteringstype: | - |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 7 Weeks |
| Producentens varenummer: | 170L9653 |
| Beskrivelse: | FUSE 1000A 660V 3KW/110 AR |
| Email: | [email protected] |
Relaterede dele til 170L9653
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
170L9868 | Eaton | FUSE 630A 1600V 3BKN/110 AR | Forespørgsel |
|
170L9604 | Eaton | FUSE 700A 660V 3STN/110 AR | Forespørgsel |
 |
170M1363 | Eaton | FUSE SQ 40A 700VAC RECTANGULAR | Forespørgsel |
|
170L9866 | Eaton | FUSE 500A 1600V 3BKN/110 AR | Forespørgsel |
|
170L9655 | Eaton | FUSE 800A 1000V 3KW/110 AR | Forespørgsel |
|
7.2OHGMA160 | Eaton | FUSE 7.2KV 160AMP 2.5" OIL | Forespørgsel |
|
170L9480 | Eaton | FUSE 1000A 660V 3TE/80 AR | Forespørgsel |
|
170L9583 | Eaton | FUSE 1000A 1000V 3BKN/75 AR | Forespørgsel |
|
170L9218 | Eaton | FUSE 550A 2000V 3BKN/140 AR | Forespørgsel |
|
170L9679 | Eaton | FUSE 450A 2000V 3TN/170 AR | Forespørgsel |
|
170L9665 | Eaton | FUSE 700A 1000V 3BN/75 AR | Forespørgsel |
 |
FWP-100A22F | Eaton | FUSE CRTRDGE 100A 700VAC/500VDC | Forespørgsel |
|
170L9217 | Eaton | FUSE 500A 2000V 3BKN/140 AR | Forespørgsel |
|
170L9203 | Eaton | FUSE 630A 660V 3STN/110 AR | Forespørgsel |
|
ACF-25 | Eaton | BUSS AIRCRAFT LIMITER | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog