Købe 200LSQ6800M64X104 med BYCHPS
Køb med garanti
200LSQ6800M64X104
- Varenummer:
- 200LSQ6800M64X104
- Fabrikant:
- Rubycon
- Beskrivelse:
- SCREW TERMINAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18466 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 200LSQ6800M64X104, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 200LSQ6800M64X104 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 200LSQ6800M64X104 |
| Udvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | SCREW TERMINAL |
| Email: | [email protected] |
Relaterede dele til 200LSQ6800M64X104
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
200LSQ6800MNB64X99 | Rubycon | CAP ALUM 6800UF 20% 200V SCREW | Forespørgsel |
 |
200LSQ3900M51X83 | Rubycon | SCREW TERMINAL | Forespørgsel |
|
200LSQ6800MEFC64X99 | Rubycon | SCREW TERMINAL | Forespørgsel |
 |
200LSQ12000MEFC77X101 | Rubycon | CAP ALUM 12000UF 20% 200V SCREW | Forespørgsel |
 |
E36D251HPN172TCA5M | United Chemi-Con | CAP ALUM 1700UF 250V SCREW | Forespørgsel |
 |
200LSQ4700MEFC51X98 | Rubycon | CAP ALUM 4700UF 20% 200V SCREW | Forespørgsel |
|
200LSQ10000MEFC64X119 | Rubycon | CAP ALUM 10000UF 20% 200V SCREW | Forespørgsel |
|
200LSQ22000M90X141 | Rubycon | SCREW TERMINAL | Forespørgsel |
|
200LSQ3300M51X83 | Rubycon | SCREW TERMINAL | Forespørgsel |
|
200TXW330MEFC16X40 | Rubycon | CAP ALUM 330UF 20% 200V RADIAL | Forespørgsel |
 |
UCY2W680MHD | Nichicon | CAP ALUM 68UF 20% 450V RADIAL | Forespørgsel |
|
200LSQ15000M77X121 | Rubycon | SCREW TERMINAL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers