Købe 3555 med BYCHPS
Køb med garanti
3555
- Varenummer:
- 3555
- Fabrikant:
- Keystone Electronics Corp.
- Beskrivelse:
- FUSE CLIP BLADE 500V 40A PCB
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19001 Pieces
- Datablad:
- 1.3555.pdf2.3555.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 3555, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 3555 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding: | 500V |
|---|---|
| Afslutningsstil: | PC Pin |
| Serie: | MAXI PC |
| Andre navne: | 3555K 3555K-ND 36-3555 |
| Orientering: | Vertical |
| Antal kredsløb: | 1 |
| Monteringstype: | PCB |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | 3555 |
| Sikringstype: | Clip |
| Sikringstype: | Blade |
| Sikringsstørrelse: | 1.15" L x 0.35" W x 1.35" H (29.21mm x 8.85mm x 34.29mm) |
| Til brug med / relaterede produkter: | MAXI® |
| Udvidet beskrivelse: | Fuse Clip 40A 500V 1 Circuit Blade PCB |
| Beskrivelse: | FUSE CLIP BLADE 500V 40A PCB |
| Nuværende vurdering: | 40A |
| Kontaktmateriale: | Copper |
| Kontakt Afslut: | Tin Nickel |
| Email: | [email protected] |
Relaterede dele til 3555
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers