Købe 400LEX1R8MEFC8X9 med BYCHPS
Køb med garanti
400LEX1R8MEFC8X9
- Varenummer:
- 400LEX1R8MEFC8X9
- Fabrikant:
- Rubycon
- Beskrivelse:
- CAP ALUM RAD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17430 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 400LEX1R8MEFC8X9, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 400LEX1R8MEFC8X9 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 400LEX1R8MEFC8X9 |
| Udvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | CAP ALUM RAD |
| Email: | [email protected] |
Relaterede dele til 400LEX1R8MEFC8X9
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
400LEX1.5MEFC8X10 | Rubycon | CAP ALUM RAD | Forespørgsel |
 |
400LEX1.2MEFC8X9 | Rubycon | CAP ALUM 1.2UF 20% 400V RADIAL | Forespørgsel |
|
400LEX1.2MEFC8X10 | Rubycon | CAP ALUM RAD | Forespørgsel |
|
400LEX1R5MEFC8X9 | Rubycon | CAP ALUM RAD | Forespørgsel |
|
400LEX4.7MEFC10X12.5 | Rubycon | CAP ALUM 4.7UF 20% 400V RADIAL | Forespørgsel |
|
400LEX2.2MEFC8X11.5 | Rubycon | CAP ALUM 2.2UF 20% 400V RADIAL | Forespørgsel |
|
400LEX6R8MEFC10X16 | Rubycon | CAP ALUM RAD | Forespørgsel |
|
400LEX1.5MEFC8X9 | Rubycon | CAP ALUM 1.5UF 20% 400V RADIAL | Forespørgsel |
|
400LEX1.8MEFC8X10 | Rubycon | CAP ALUM RAD | Forespørgsel |
|
400LEX2.2MEFC8X9 | Rubycon | CAP ALUM 2.2UF 20% 400V RADIAL | Forespørgsel |
|
400LEX1R2MEFC8X9 | Rubycon | CAP ALUM RAD | Forespørgsel |
|
400LEX1.8MEFC8X9 | Rubycon | CAP ALUM 1.8UF 20% 400V RADIAL | Forespørgsel |
|
400LEX1MEFC6.3X11 | Rubycon | CAP ALUM 1UF 20% 400V RADIAL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers