Købe 400MXH120MEFC20X30 med BYCHPS
Køb med garanti
400MXH120MEFC20X30
- Varenummer:
- 400MXH120MEFC20X30
- Fabrikant:
- Rubycon
- Beskrivelse:
- SNAP TERMINAL
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16528 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 400MXH120MEFC20X30, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 400MXH120MEFC20X30 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 400MXH120MEFC20X30 |
| Udvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | SNAP TERMINAL |
| Email: | [email protected] |
Relaterede dele til 400MXH120MEFC20X30
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
400MXH180MEFCSN25X25 | Rubycon | CAP ALUM 180UF 20% 400V SNAP | Forespørgsel |
 |
400MXH150MEFC20X30 | Rubycon | SNAP TERMINAL | Forespørgsel |
 |
400MXH120MEFCSN22X25 | Rubycon | CAP ALUM 120UF 20% 400V SNAP | Forespørgsel |
|
400MXH120MEFC22X25 | Rubycon | CAP ALUM 120UF 20% 400V SNAP | Forespørgsel |
 |
400MXH1200MEFCSN35X60 | Rubycon | CAP ALUM 1200UF 20% 400V SNAP | Forespørgsel |
 |
400MXH150MEFCSN22X30 | Rubycon | CAP ALUM 150UF 20% 400V SNAP | Forespørgsel |
|
400MXH180MEFC25X25 | Rubycon | CAP ALUM 180UF 20% 400V SNAP | Forespørgsel |
|
400MXH150MEFCSN20X30 | Rubycon | CAP ALUM 150UF 20% 400V SNAP | Forespørgsel |
|
400MXH120MEFCSN20X30 | Rubycon | CAP ALUM 120UF 20% 400V SNAP | Forespørgsel |
|
400MXH1000MEFCSN35X55 | Rubycon | CAP ALUM 1000UF 20% 400V SNAP | Forespørgsel |
|
400MXH180MEFCSN22X30 | Rubycon | CAP ALUM 180UF 20% 400V SNAP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers