Købe 450MXG470MEFC30X45 med BYCHPS
Køb med garanti
450MXG470MEFC30X45
- Varenummer:
- 450MXG470MEFC30X45
- Fabrikant:
- Rubycon
- Beskrivelse:
- SNAP TERMINAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15655 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 450MXG470MEFC30X45, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 450MXG470MEFC30X45 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 450MXG470MEFC30X45 |
| Udvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | SNAP TERMINAL |
| Email: | [email protected] |
Relaterede dele til 450MXG470MEFC30X45
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
450MXG470MEFC35X40 | Rubycon | CAP ALUM 470UF 20% 450V SNAP | Forespørgsel |
|
450MXG470MEFC30X50 | Rubycon | CAP ALUM 470UF 20% 450V SNAP | Forespørgsel |
 |
450MXG470MEFCSN30X50 | Rubycon | CAP ALUM 470UF 20% 450V SNAP | Forespørgsel |
 |
450MXG470MEFCSN35X40 | Rubycon | CAP ALUM 470UF 20% 450V SNAP | Forespørgsel |
|
450MXG390MEFC30X45 | Rubycon | CAP ALUM 390UF 20% 450V SNAP | Forespørgsel |
|
450MXG82MEFC22X25 | Rubycon | CAP ALUM 82UF 20% 450V SNAP | Forespørgsel |
|
450MXG100MEFCSN22X30 | Rubycon | CAP ALUM 100UF 20% 450V SNAP | Forespørgsel |
|
450MXG220MEFC25X40 | Rubycon | CAP ALUM 220UF 20% 450V SNAP | Forespørgsel |
 |
450MXG270MEFCSN22X55 | Rubycon | CAP ALUM 270UF 20% 450V SNAP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers