Købe 74SSTVF16859NLG med BYCHPS
Køb med garanti
74SSTVF16859NLG
- Varenummer:
- 74SSTVF16859NLG
- Fabrikant:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC BUFFER 13-26BIT SSTL 56VFQFPN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15574 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 74SSTVF16859NLG, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 74SSTVF16859NLG via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Forsyningsspænding: | 2.3 V ~ 2.7 V |
|---|---|
| Leverandør Device Package: | 56-VFQFPN (8x8) |
| Serie: | 74SSTVF |
| Emballage: | Tray |
| Pakke / tilfælde: | 56-VFQFN Exposed Pad |
| Andre navne: | IDT74SSTVF16859NLG IDT74SSTVF16859NLG-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal bitter: | 13, 26 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | 74SSTVF16859NLG |
| Logik Type: | Registered Buffer with SSTL_2 Compatible I/O for DDR |
| Udvidet beskrivelse: | Registered Buffer with SSTL_2 Compatible I/O for DDR IC 56-VFQFPN (8x8) |
| Beskrivelse: | IC BUFFER 13-26BIT SSTL 56VFQFPN |
| Email: | [email protected] |
Relaterede dele til 74SSTVF16859NLG
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
74SSTVF16859PAG | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 64-TSSOP | Forespørgsel |
|
74SSTVF16859NLG8 | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 56VFQFPN | Forespørgsel |
|
74SSTVF16859PAG8 | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 64-TSSOP | Forespørgsel |
|
74SSTVF16857PAG8 | IDT, Integrated Device Technology Inc | IC BUFFER 14BIT SSTL I/O 48TSSOP | Forespørgsel |
|
74SSTVF16857PAG | IDT, Integrated Device Technology Inc | IC BUFFER 14BIT SSTL I/O 48TSSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog