Købe 784775247 med BYCHPS
Køb med garanti
784775247
- Varenummer:
- 784775247
- Fabrikant:
- Wurth Electronics
- Beskrivelse:
- FIXED IND 470UH 360MA 1.96 OHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17251 Pieces
- Datablad:
- 1.784775247.pdf2.784775247.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 784775247, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 784775247 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Leverandør Device Package: | 7850 |
| Størrelse / Dimension: | 0.307" L x 0.276" W (7.80mm x 7.00mm) |
| Afskærmning: | Unshielded |
| Serie: | WE-PD2A |
| Vurderinger: | AEC-Q200 |
| Q @ Freq: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Nonstandard |
| Andre navne: | 732-6873-2 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Ferrite |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 784775247 |
| selvinduktion: | 470µH |
| Højde - Siddende (Max): | 0.217" (5.50mm) |
| Frekvens - Test: | 10kHz |
| Frekvens - Selvresonans: | 3MHz |
| Udvidet beskrivelse: | 470µH Unshielded Wirewound Inductor 360mA 1.96 Ohm Max Nonstandard |
| Beskrivelse: | FIXED IND 470UH 360MA 1.96 OHM |
| DC-resistens (DCR): | 1.96 Ohm Max |
| Nuværende vurdering: | 360mA |
| Nuværende - Mætning: | 380mA |
| Email: | [email protected] |
Relaterede dele til 784775247
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers