Købe 8869670000 med BYCHPS
Køb med garanti
8869670000
- Varenummer:
- 8869670000
- Fabrikant:
- Weidmuller
- Beskrivelse:
- RIM-I 2 24/60VDC
- Blyfri Status / RoHS Status:
- Ikke anvendelig / Ikke anvendelig
- Tilgængelig mængde:
- 15986 Pieces
- Datablad:
- 8869670000.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 8869670000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 8869670000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| specifikationer: | Red LED, 24 ~ 60VDC, Protection Diode |
|---|---|
| Serie: | RIM |
| Fabrikantens standard ledetid: | 7 Weeks |
| Producentens varenummer: | 8869670000 |
| Til brug med / relaterede produkter: | SRC Sockets |
| Udvidet beskrivelse: | Module, LED and/or Protection SRC Sockets |
| Beskrivelse: | RIM-I 2 24/60VDC |
| Farve: | - |
| Tilbehørstype: | Module, LED and/or Protection |
| Email: | [email protected] |
Relaterede dele til 8869670000
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
8869600000 | Weidmuller | RIM-I 2 6/24VDC GN | Forespørgsel |
 |
8869660000 | Weidmuller | RIM-I 3 110/230VUC GN | Forespørgsel |
 |
8869680000 | Weidmuller | RIM-I 2 24/60VDC GN | Forespørgsel |
 |
7-1393159-9 | TE Connectivity Potter & Brumfield Relays | ENCLOSURE PANEL PLUG | Forespørgsel |
 |
RSBUSS00 | Red Lion Controls | RELAY SYSTEM PLC BUSS BLOCK | Forespørgsel |
 |
8869630000 | Weidmuller | RIM-I 3 6/24VUC | Forespørgsel |
 |
8869610000 | Weidmuller | RIM-I 3 24/60VUC | Forespørgsel |
 |
8869640000 | Weidmuller | RIM-I 3 6/24VUC GN (GREEN) | Forespørgsel |
 |
8869690000 | Weidmuller | RIM-I 2 110/230VDC | Forespørgsel |
 |
8869650000 | Weidmuller | RIM-I 3 110/230 V UC | Forespørgsel |
 |
8869620000 | Weidmuller | RIM-I 3 24/60VUC GN | Forespørgsel |
 |
11.06.305 | Crydom Co. | PB32M PB32SM HOLD-DOWN BAR | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers