Købe ALS70H363LM100 med BYCHPS
Køb med garanti
ALS70H363LM100
- Varenummer:
- ALS70H363LM100
- Fabrikant:
- KEMET
- Beskrivelse:
- ALU SCREW TERMINAL 36000UF 100V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16409 Pieces
- Datablad:
- ALS70H363LM100.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ALS70H363LM100, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ALS70H363LM100 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | ALS70H363LM100 |
| Udvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | ALU SCREW TERMINAL 36000UF 100V |
| Email: | [email protected] |
Relaterede dele til ALS70H363LM100
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
ALS70H363DE040 | KEMET | ALU SCREW TERMINAL 36000UF 40V | Forespørgsel |
|
ALS70H394QM040 | KEMET | ALU SCREW TERMINAL 390000UF 40V | Forespørgsel |
|
ALS70H363QW200 | KEMET | ALU SCREW TERMINAL 36000UF 200V | Forespørgsel |
|
ALS70H332LM500 | KEMET | ALU SCREW TERMINAL 3300UF 500V | Forespørgsel |
|
ALS70H362KE250 | KEMET | ALU SCREW TERMINAL 3600UF 250V | Forespørgsel |
|
ALS70H362QC450 | KEMET | ALU SCREW TERMINAL 3600UF 450V | Forespørgsel |
|
ALS70H363QT250 | KEMET | ALU SCREW TERMINAL 36000UF 250V | Forespørgsel |
|
ALS70H363MF100 | KEMET | ALU SCREW TERMINAL 36000UF 100V | Forespørgsel |
|
ALS70H363NT200 | KEMET | ALU SCREW TERMINAL 36000UF 200V | Forespørgsel |
|
ALS70H361DA500 | KEMET | ALU SCREW TERMINAL 360UF 500V | Forespørgsel |
|
ALS70H364QT063 | KEMET | ALU SCREW TERMINAL 360000UF 63V | Forespørgsel |
|
ALS70H363QS250 | KEMET | ALU SCREW TERMINAL 36000UF 250V | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog