Købe APTSM120AM08CT6AG med BYCHPS
Køb med garanti
APTSM120AM08CT6AG
- Varenummer:
- APTSM120AM08CT6AG
- Fabrikant:
- Microsemi
- Beskrivelse:
- POWER MODULE - SIC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15885 Pieces
- Datablad:
- APTSM120AM08CT6AG.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for APTSM120AM08CT6AG, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til APTSM120AM08CT6AG via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 3V @ 10mA |
|---|---|
| Leverandør Device Package: | SP6 |
| Serie: | - |
| Rds On (Max) @ Id, Vgs: | 10 mOhm @ 200A, 20V |
| Strøm - Max: | 2300W |
| Emballage: | Bulk |
| Pakke / tilfælde: | SP6 |
| Driftstemperatur: | -40°C ~ 175°C (TJ) |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 22 Weeks |
| Producentens varenummer: | APTSM120AM08CT6AG |
| Gate Charge (Qg) (Max) @ Vgs: | 1360nC @ 20V |
| FET Type: | 2 N-Channel (Dual), Schottky |
| FET-funktion: | Silicon Carbide (SiC) |
| Udvidet beskrivelse: | Mosfet Array 2 N-Channel (Dual), Schottky 1200V (1.2kV) 370A (Tc) 2300W Chassis Mount SP6 |
| Afløb til Source Voltage (VDSS): | 1200V (1.2kV) |
| Beskrivelse: | POWER MODULE - SIC |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 370A (Tc) |
| Email: | [email protected] |
Relaterede dele til APTSM120AM08CT6AG
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
APTSM120AM14CD3AG | Microsemi Corporation | POWER MODULE - SIC | Forespørgsel |
|
APTSM120TAM33CTPAG | Microsemi Corporation | POWER MODULE - SIC | Forespørgsel |
|
APTSM120AM25CT3AG | Microsemi Corporation | POWER MODULE - SIC | Forespørgsel |
|
APTSM120AM09CD3AG | Microsemi Corporation | POWER MODULE - SIC | Forespørgsel |
|
APTSM120AM55CT1AG | Microsemi Corporation | POWER MODULE - SIC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers